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Semiconductor Package and Assembly Designer

Petah Tikva, Israel
VLSI
Full time
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The position

Join our advanced packaging team to define and develop cutting-edge semiconductor package solutions for automotive-grade digital and RF System-on-Chip (SoC) products.
You’ll collaborate with internal teams and external OSATs to deliver high-performance, manufacturable, and reliable packages that meet stringent automotive standards.

What will your job look like:

  • Define and specify advanced package architectures for digital SoCs and RF ICs in automotive applications.
  • Perform substrate design for flip-chip BGA (FC-BGA) packages, including stack-up, routing, and ball-out optimizations.
  • Evaluate and select substrate technologies, materials, and package solutions based on performance, cost, and reliability.
  • Collaborate with OSATs to define and validate assembly materials and process flows.
  • Work closely with internal teams such as Backend, SIPI, Product Engineering, and Quality & Reliability to ensure seamless integration.
  • Monitor yield, quality, and manufacturability across package development and production stages.
  • Support DFM reviews and ensure compliance with automotive standards and customer requirements

All you need is:

  • B.Sc. or M.Sc. in Electrical Engineering, Materials Science, or a related field.
  • 3+ years of experience in semiconductor package design and assembly.
  • Deep knowledge of package design, substrate engineering, and simulation methodologies.
  • Hands-on experience with package layout tools such as Cadence Allegro Package Designer or Xpedition Package Designer.
  • Solid understanding of high-speed layout constraints (e.g., crosstalk, EMI, RFI) and proven experience with interfaces like DDR, PCIe, MIPI, and UFS.
  • Strong background in schematic review, capture, and system-level integration.
  • Proficiency in scripting for automation and design optimization with tools like MATLAB or Python – advantage.
  • Proficiency in layout design verification tool such as CAM350- advantage.
  • Experience working directly with OSATs – advantage.
  • Proven experience with SIPI simulation tools like Ansys SIwave, Ansys HFSS,  Cadence Sigrity and Siemens HyperLynx – advantage.
  • Proven experience with thermal or thermo-mechanical simulation tools like Cadence Celsius, Ansys Icepak, Ansys Mechanical and Flotherm - advantage.
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